IC Packaging Technology Expo - ICP

Date
2014-01-15 - 2014-01-17
Exhibitors
1149
Floor Size
744216
Attendees
71322
Event contact title
Event Manager
Event contact first name
Hajime
Event contact last name
Suzuki
Email
inw@reedexpo.co.jp
Event contact telephone number
+81-3-3349-8502
Fax
+81-3-3349-4900
Description

All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here. ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.

Attendee information

All kinds of products, technologies and services that can contribute to miniaturization and thinning of cutting-edge devices such as Semiconductors, LED, Power Devices, Sensors and MEMS will gather here.

Exhibitor information

ICP is an essential business venue for the professionals from a variety of fields to seek for packaging technologies.

Partner Voices

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