IWLPC - International Wafer-Level Packaging Conference

Date
2015-10-13 - 2015-10-15
Organizer
Event contact title
To exhibit or sponsor:
Event contact first name
Kim
Event contact last name
Newman
Email
knewman@chipscalereview.com
Event contact telephone number
408-429-8585
Description

IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Attendee information

What type of attendees will you network with at IWLPC?
Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!

Partner Voices

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