IWLPC - International Wafer-Level Packaging Conference

Date
2015-10-13 - 2015-10-15
Organizer
Event contact title
To exhibit or sponsor:
Event contact first name
Kim
Event contact last name
Newman
Email
knewman@chipscalereview.com
Event contact telephone number
408-429-8585
Description

IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Attendee information

What type of attendees will you network with at IWLPC?
Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!

Partner Voices

When you’re planning your next business meeting or trade show and it’s time to get deals done, there’s one place that has everything for any size group – Las Vegas.

Las Vegas is the place for business and has the perfect space to accommodate even the largest of assemblies. Three of the country’s 10 largest convention venues are in Las Vegas, all part of more than 11 million square feet of exhibit space throughout the city.