NEPCON Malaysia 2017

Date
2017-06-06 - 2017-06-08
Organizer
Exhibitors
0
Event contact title
Contact
Event contact first name
Teo Hui
Event contact last name
Hiang
Email
huihiang.teo@reedexpo.com.sg
Event contact telephone number
6567804602
Description

NEPCON workshop series gathers experts from around the world under one roof. Everything you need to know about Electronic Packaging and be at par with the changing technology is presented in this NEPCON workshop series. Our workshops feature innovative solutions for our Malaysian Electronics Industry and identifies drivers to our competitive advantage. Gain new insights and solutions on improving your assembly processes, reducing defects, improving reliability and resolving issues on assembly of challenging components!

Attendee information

Open to all

Partner Voices

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