Thin Wall Packaging 2014
AMI's Thin Wall Packaging 2014 takes place on May 20-21, 2014 at The Westin Chicago North Shore in Chicago, IL, USA. Thin Wall Packaging 2014 will offer a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in lightweight plastics packaging.
Thin Wall Packaging like tubs, cups, pots, trays, clamshells and plastic jars, provides a means of supplying consumer appeal, convenience and product protection, whilst reducing the carbon footprint. Barrier properties can be tailored to the application by careful material selection to be cost-effective. Innovative designs are enabled by developments in manufacturing technology. Applications include margarine, yogurt, ice cream, meat, bakery, fresh fruit and vegetables. TV dinners are a rapidly growing market as households work harder: microwave, freezer and oven-proof containers are included in this sector.
Thin Wall Packaging 2014 will provide lively interaction and debate between the speakers and delegates, and gives a comprehensive overview of the latest materials, technology and market trends in lightweight packaging.
Running in conjunction with the conference, the table top exhibition is an integral part of the event, providing the ideal setting to promote your company and its products to an international audience.