Thin Wall Packaging 2017
The 6th AMI international conference on thin wall packaging will take place on May 23-24, 2017 at The Westin Chicago North Shore in Chicago, IL, USA. Located in the heart of the packaging industry, attendees will participate in second-to-none networking and experience a compelling conference program. Thin Wall Packaging 2017 will offer a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging. In conjunction to the conference, Intertek will host a food packaging safety and regulatory compliance seminar on May 25th.
Running in conjunction with the conference, the table top exhibition is an integral part of the event, providing the ideal setting to promote your company and its products to an international audience.