Thin Wall Packaging 2018
The 7th AMI international conference on thin wall packaging will take place on March 20-21, 2018 at The Westin Chicago North Shore in Chicago, IL, USA. Located in the heart of the packaging industry, attendees participated in second-to-none networking and experienced a compelling conference program.
Thin Wall Packaging 2018 offers a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging.
For further information on this conference, please contact Agata Swietek, Conference Organizer at email@example.com or call +44 (0) 117 314 8111
Running in conjunction with the conference, the table top exhibition is an integral part of the event, providing the ideal setting to promote your company and its products to an international audience.