3D & Systems Summit 2019

Date
2019-01-28 - 2019-01-30
Organizer
Exhibitors
0
Event contact title
Senior Manager
Event contact first name
Christina
Event contact last name
Fritsch
Email
cfritsch@semi.org
Event contact telephone number
+49 30 3030807718
Notes

Venue: DRESDEN HILTON HOTEL

Description

The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors. 

Attendee information

2019 MAIN TOPICS & HIGHLIGHTS:  

  • 3DIC Through-Silicon-Via (TSV) technology 
  • 2.5D, 3D FO-WLP/e-WLB
  • Active and passive interposers
  • Stacked dies or stacked wafers 
  • 3D alternative technologies 
  • 5G Integration
  • Invited speakers and Keynotes
  • Exhibition area
  • Networking opportunities

Partner Voices

Atlantic City is a hidden gem along the New Jersey shoreline, offering visitors much more than a seaside destination. As Atlantic City has gone through numerous transitions, the destination is in the midst of the dawn of a new era, drawing from its rich history to meet the demands of the future.