With 900 papers and presentations, SPIE LASE is the most important laser technologies conference in the field. Topics include laser manufacturing, laser materials processing, micro-nano packaging, fiber, diode, solid state lasers, laser resonators, ultrafast, semiconductor lasers and LEDs, and 3D fabrication technologies.
SPIE LASE has developed into the main forum and meeting place for not only laser science and laser scientists, but also for novel laser applications and laser process engineers. The main communities participating in LASE are technology innovators reporting their latest developments and research discoveries.
Participation from academia is stable, and we have seen increasing participation from benefiting industries like microelectronics, computers, machine tools, and classical industries including automotive and manufacturing. LASE increasingly addresses business closer to the end user, closing the gap from bottom up competency oriented novelties and new science to market driven visions of new societal benefits from the point of view of the end user.