Semi European 3D TSV Summit

Date
2014-01-20 - 2014-01-22
Venue
Organizer
Floor Size
5381
Event contact title
Event Organizer / Business Development Manager
Event contact first name
Yann
Event contact last name
Guillou
Email
yguillou@semi.org
Event contact telephone number
+33 4 38783971
Description
SEMI Europe announces the 2nd edition of the European 3D TSV Summit. The event will be held on Jan 20-22, 2014 in Grenoble (France).
  
Building on the success of the 1st edition that attracted almost 320 people from 20 countries, the theme of this year’s event is “Application Ready,” addressing 3D TSV from both a Business and Technology perspective.
 
The latest TSV product developments and achievements — including cost, business models, supply chain, manufacturability and technology aspects — will be addressed by executives and experts from global companies. 
   
The European 3D TSV Summit will demonstrate the full range of 3D technology and R&D processes, with leading companies participating, showing a range from initial prototypes to high-volume production.
Exhibitor information

500 m² of exhibiting area

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