Semi European 3D TSV Summit 2017

2017-01-23 - 2017-01-25
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Administration and Finance
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+33 456 593055

This year’s 5th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications. Spotlight on Applications and future 3D Technologies Reputable keynote and invited speakers will present their choices and strategies among the 3D Integration technologies pallet, giving particular attention to current adoption for applications such as high-end memories, performance applications, mobile, imaging and automotive. To keep up with the rapid growth in the market, companies will be forced to stay up-to-date with all of the latest breakthroughs in this cutting-edge technology but also with the market changes. SEMI is proud to accompany this new technology into the future by offering an event that allows professionals to exchange viewpoints on the market impacts and technological advances of 3D packaging integration In the Market for 3D As in previous 3D Summit editions, SEMI intends to highlight the latest business challenges and opportunities in the 3D sector by kicking off the summit with a market briefing. At the market briefing, attendees will hear from several 3D and packaging industry experts who will present their exclusive business & market insights and reverse engineering analysis confirming the huge growth of advanced packaging as forecasted. Mixing Business and Pleasure A gala dinner and a cocktail hour, along with frequent coffee and lunch breaks will provide attendees with numerous moments for relaxed networking. In addition, attendees will take advantage of a free one-on-one business meeting platform as well as a tour of the MINATEC Innovation Showroom.

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