The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D roadmap, Heterogeneous Integration and System-In-Package manufacturing.
The brand new agenda will focus on disruptive applications like Mobile IOT, High Reliability and High Performance. Invited high-caliber speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.
2020 Main Topics and Highlights
- 3DIC Through-Silicon-Via (TSV) technology
- 2.5D, 3D FO-WLP/e-WLB
- Heterogeneous Integration
- Stacked dies or stacked wafers
- 3D alternative technologies
- 5G Applications
- uLED and photonics applications
- Invited speakers and Keynotes
- Exhibition area
- Networking opportunities
WHO SHOULD ATTEND:
The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications.
- CTO’s hi tech companies
- OSAT senior managers
Date and Time:
27 JAN | 16:00 – 21:00
28 JAN | 8:00 – 22:00
29 JAN | 8:15 – 14:00