Semi European 3D TSV Summit 2020

Date
2020-01-27 - 2020-01-29
Organizer
Exhibitors
0
Floor Size
0
Attendees
0
Event contact title
Contact
Event contact first name
Reviliani
Event contact last name
Gani
Email
rgani@semi.org
Event contact telephone number
+33 - 4 - 56 593059
Description

The 3D & Systems Summit will address the most relevant and advanced topics related to the 3D roadmap, Heterogeneous Integration and System-In-Package manufacturing.

The brand new agenda will focus on disruptive applications like Mobile IOT, High Reliability and High Performance.  Invited high-caliber speakers, an exhibition area, B2B matchmaking, unique networking and business opportunities await all participants and exhibitors.

2020 Main Topics and Highlights

  • 3DIC Through-Silicon-Via (TSV) technology
  • 2.5D, 3D FO-WLP/e-WLB
  • Heterogeneous Integration
  • Stacked dies or stacked wafers
  • 3D alternative technologies
  • 5G Applications
  • uLED and photonics applications
  • Invited speakers and Keynotes
  • Exhibition area
  • Networking opportunities
Attendee information
WHO SHOULD ATTEND:

The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. 

  • CTO’s hi tech companies
  • OSAT senior managers
  • Principals

Date and Time:

27 JAN | 16:00 – 21:00
28 JAN |  8:00 – 22:00
29 JAN |  8:15 – 14:00

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