Thin Wall Packaging 2017

Date
2017-05-23 - 2017-05-24
Organizer
Exhibitors
0
Event contact title
Conference Coordinator
Event contact first name
Amanda
Event contact last name
Schaeffer
Email
as@amiplastics-na.com
Event contact telephone number
+1 610 478 0800
Description

The 6th AMI international conference on thin wall packaging ​​will take place on May 23-24, 2017 at The Westin Chicago North Shore in Chicago, IL, USA. Located in the heart of the ​packaging industry, attendees will participate in second-to-none networking and experience a compelling conference program. Thin Wall Packaging 2017 will offer a unique networking opportunity for leading food companies, retailers, packaging manufacturers, researchers, and suppliers of the industry to debate the latest developments and market trends in light weight plastics packaging. In conjunction to the conference, Intertek will host a food packaging safety and regulatory compliance seminar on May 25th.

Exhibitor information

Running in conjunction with the conference, the table top exhibition is an integral part of the event, providing the ideal setting to promote your company and its products to an international audience.

Partner Voices

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