Semi European 3D TSV Summit 2019

Date
2019-01-28 - 2019-01-30
Organizer
Exhibitors
0
Floor Size
0
Attendees
0
Event contact title
European Sales Manager
Event contact first name
Denada
Event contact last name
Hodaj
Email
dhodaj@semi.org
Event contact telephone number
+33 - 4 - 56 593059
Description

The 3D & Systems Summit will address the most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications. After six successful editions of the European 3D Summit, SEMI Europe invites you to join the 1st Edition of 3D & Systems Summit taking place in January 2019 in Dresden, Germany. The event will offer a brand new agenda, invited high-caliber speakers, exhibition area and unique networking opportunities to all participants and exhibitors.

2019 MAIN TOPICS & HIGHLIGHTS  

  • 3DIC Through-Silicon-Via (TSV) technology 

  • 2.5D, 3D FO-WLP/e-WLB

  • Active and passive interposers

  • Stacked dies or stacked wafers 

  • 3D alternative technologies 

  • 5G Integration

  • Invited speakers and Keynotes

  • Exhibition area

  • Networking opportunities

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