IWLPC - International Wafer-Level Packaging Conference

Date
2015-10-13 - 2015-10-15
Organizer
Event contact title
To exhibit or sponsor:
Event contact first name
Kim
Event contact last name
Newman
Email
knewman@chipscalereview.com
Event contact telephone number
408-429-8585
Description

IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Attendee information

What type of attendees will you network with at IWLPC?
Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!

Partner Voices

Modern events accumulate huge amounts of data.  Turning that data into an understanding of your audience in order to build attendance can be overwhelming.  Fortunately, business analytics tools like CDS’ Data Sense® can do the heavy lifting, combining your different data sources for a detailed view of your event and audience.  Introducing the Persona Tree!