IWLPC - International Wafer-Level Packaging Conference

Date
2015-10-13 - 2015-10-15
Organizer
Event contact title
To exhibit or sponsor:
Event contact first name
Kim
Event contact last name
Newman
Email
knewman@chipscalereview.com
Event contact telephone number
408-429-8585
Description

IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Attendee information

What type of attendees will you network with at IWLPC?
Assembly/Packaging Engineers, Corporate/General Management, Test Engineering, Engineering Management, IC Design Engineer, Manufacturing Management, PC Board Design/Fabrication, Purchasing, R&D, Sales/Marketing, Consultant, and many more!

Partner Voices

Business success — you may think it’s all about the bottom line, but savvy CEOs like those at Apple, Starbucks and IKEA know otherwise. Although profits play a big role, it’s also important for companies to be socially responsible by considering their impact on the environment, their local economy and their customers. One way that companies can practice corporate social responsibility (CSR) is by incorporating it into company events.