Semi European 3D TSV Summit 2018

Date
2018-01-22 - 2018-01-24
Organizer
Exhibitors
0
Floor Size
5381
Event contact title
Manager Marketing and Communications
Event contact first name
Serena
Event contact last name
Brischetto
Email
sbrischetto@semi.org
Event contact telephone number
+33 456 593055
Notes

Venue:

art’otel Dresden

Description

This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.

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