Semi European 3D TSV Summit 2018

Date
2018-01-22 - 2018-01-24
Organizer
Exhibitors
0
Floor Size
5381
Event contact title
Manager Marketing and Communications
Event contact first name
Serena
Event contact last name
Brischetto
Email
sbrischetto@semi.org
Event contact telephone number
+33 456 593055
Notes

Venue:

art’otel Dresden

Description

This year’s 6th edition of SEMI European 3D Summit will continue to explore a wider scope of 3D topics that will include 3DIC Through-Silicon-Via (TSV) technology and its challenges, but also talks on 2.5D, 3D FO-WLP/ e-WLB, Glass interposers, thermal management and 3D alternative technologies in order to create Heterogeneous Integration and High Density Systems for different applications.

Partner Voices

The Massachusetts Convention Center Authority’s Public Safety Team at the Boston Convention & Exhibition Center (BCEC) and the Hynes Convention Center (Hynes) have taken their experiences to develop a comprehensive crisis management and emergency preparedness training program.